19. Jul 2016 00:07, rigidflexpcb
The Best Company for Scanning Acoustic Microscopy If you know nothing about acoustic microscopy, this article can be a great help in providing you the basic understanding of the topic. Acoustic Microscopy is a non-destructive screening technique that provides a unique insight on the integrity of package and device construction. The advantages include the detection of void formations, cracks and fractures, delaminations, and other internal defects within device type and inherently susceptible materials. A wide range of device types like CSP's, BGA's, SOIC's, encapsulating materials, flex circuits, rigid flex pcb PCB's molding compounds, and other products may be analyzed. Testing performed to J-STD-035, IPC/JEDEC, PCB Flexible acoustic microscopy for Non Hermetic Encapsulated Electronic components, or client requirements.
In the scanning acoustic microscopy process, a high frequency ultrasound transducer emits sound waves that can be received back or transmitted through a material. And then the acoustic signature or waveform may be then interpreted to determine variations of acoustic impedance within a sample. A change in material densities or separation at an interface may be observed by difference in acoustic impedance. The transducer can also be scanned mechanically across the sample in a raster pattern receiving and emitting the ultrasound signal so as to generate an image that is a pulse-echo. An immersion fluid medium such as DI water is used to acoustically couple the sample while performing the analysis.
Below-mentioned are explained acoustic microscopy scan measurement modes:
This mode is used to characterize a single point of interest in a specimen. A-scan is also used as a convenient method of focusing the microscope.
This scan mode generates a top-down or X-Z axis cross sectional image of the sample.Tilted artifacts or non-planar fracture propagation or features can be identified.
The C-scan mode or pulse-echo provides a planner view image at a specific depth. This mode can generate the void formation and delaminations.
This mode generates images that are based on variations in acoustic impedance. This process is often necessary to verify defects observed during c-scan mode analysis.
Scanning acoustic microscopy is used in a variety of applications such as ceramic capacitor defects, die attach defects, flip chips, plastic package defects, pharmaceutical and medical package defects, metal ball grid arrays, ball grid arrays, plastic encapsulated IC's, multi-chip modules, bonded wafers. When you are going to hire a company for acoustic scanning microscopy, it is recommended that you should hire a leading company so as to get top quality services. For more detail about, you can visit the websites of the companies working in this domain.
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